Preform solder and method of manufacturing the same, and method of manufacturing solder joint

ABSTRACT

Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

CROSS-REFERENCE TO RELATED APPLICATION

Priority is claimed on Japanese Patent Application No. 2021-059319,filed Mar. 31, 2021, the content of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a preform solder and a method ofmanufacturing the same, and a method of manufacturing a solder joint.

Description of Related Art

In recent years, as an operation environment of a power semiconductorelement using silicon carbide (SiC) or the like has become higher intemperature, a solder joint may reach about 250 to 280° C. For thisreason, upon an operation under such high temperature conditions, a hightemperature solder that does not melt is required.

In fabrication of a solder joint, various types of solder pastes areused as soldering materials. For example, as solder pastes, Ag pastethat can be sintered at a low temperature and a transient liquid phase(TLP) paste corresponding to the RoHS Directive of the European Unionmay be exemplified.

A TLP paste is a paste containing two types of solder powders. In theTLP paste, since the solder powders form a high melting point compoundupon heating, it is possible to suppress remelting even when a solderjoint is reheated. As such a TLP paste, for example, a paste in which Cuballs and Sn solder balls are dispersed via a flux is proposed (seePatent Document 1).

Alternatively, in fabrication of a solder joint, a bonding method usinga preform solder as a soldering material may be utilized.

A preform solder is a solder processed into various shapes such as asquare shape, a ribbon shape, a disk shape, and the like.

As such a preform solder, for example, a molding solder made bypressure-molding a mixture of metal powders formed of a solder alloy andmetal powder formed of Cu has been proposed (see Patent Documents 2 and3).

PATENT DOCUMENTS [Patent Document 1]

Japanese Unexamined Patent Application, First Publication No.2002-254194

[Patent Document 2]

Japanese Unexamined Patent Application, First Publication No. 2020-55032

[Patent Document 3]

Japanese Unexamined Patent Application, First Publication No.2020-142300

SUMMARY OF THE INVENTION

However, the solder paste containing the flux as described in PatentDocument 1 has a problem that the flux volatilizes during melting of thesolder powder, cavities remain in the melting solder, and a large amountof voids are likely to occur during solidification. In particular,during solidification, in the TLP paste in which a high melting pointcompound is formed, fluidity decreases and it becomes difficult for thecavities to be released to the outside.

As the method of suppressing occurrence of such voids, it is conceivableto adjust the heating conditions, and for example, a heating temperaturemay be increased to increase fluidity, but there is concern of thermaldamage to the semiconductor element. Meanwhile, even when the heatingtemperature is lowered and a heating time is lengthened, it is difficultto release the cavities because the fluidity is not improved, andoccurrence of voids is inevitable.

In a TLP paste, during heating, a strong oxide film is formed on asurface of the solder powder, and an oxide film may remain without beingreduced by the flux. For this reason, it becomes difficult for thesolder powders to fuse with each other, and cavities may be incorporatedinto the melting solder, resulting in voids.

On the other hand, in order to reduce the oxide film, although it isconceivable to add a highly active reducing agent to the flux, thereducing gas becomes incorporated during solder melting even when ahighly active reducing agent is added, a porous solder joint containingreducing gas results, and as a result, bonding strength is lowered. Forthis reason, cracks are likely to occur in the solder joint, andreliability is inferior.

In addition, in a solder paste, the particle size of the solder powdermay be reduced so that the solder powder is uniformly dispersed in theflux. However, the smaller the particle size of the solder powder, thelarger the specific surface area of the powder, which makes it easierfor the solder powder to oxidize and occurrence of the voids to be moresignificant.

When the preform solder disclosed in Patent Documents 2 and 3 is used,an effect of suppressing occurrence of the voids during solder bondingunder a high temperature condition (250° C. or more) of the powersemiconductor element is weak, and bonding strength of the solderbonding portion is insufficient.

In consideration of the above-mentioned circumstances, the presentinvention is directed to providing a preform solder and a method ofmanufacturing the same that are capable of further suppressingoccurrence of voids during solder bonding, and a method of manufacturinga solder joint using the preform solder.

The present invention employs the following means in order to solve theabove-mentioned problems.

(1) A preform solder including a first metal containing Sn, and a secondmetal formed of an alloy containing Ni and Fe.

(2) In the preform solder according to (1), a content of the secondmetal may be 5 to 70 mass % with respect to a total content of the firstmetal and the second metal.

(3) In the preform solder according to (1) or (2), a particle size ofthe second metal may be 0.1 to 1000 μm.

(4) A preform solder having a metal structure including a first phasethat is a continuous phase, and a second phase dispersed in the firstphase, the first phase containing Sn, the second phase being formed ofan alloy containing Ni and Fe, and a grain boundary of a metal beingpresent in the first phase.

(5) In the preform solder according to (4), a content of intermetalliccompound of Sn and Ni in the metal structure is 0 mass % or more and 70mass % or less with respect to a total mass of the metal structure.

(6) A method of manufacturing a preform solder including a mixingprocess of mixing a first metal powder containing Sn and a second metalpowder formed of an alloy containing Ni and Fe and preparing a metalpowder mixture; and a rolling process of rolling the metal powdermixture and fabricating a preform solder.

(7) In the method of manufacturing a preform solder according to (6), inthe mixing process, the first metal powder and the second metal powdermay be mixed at a ratio of 30 to 95 parts of the first metal powder to 5to 70 parts of the second metal powder.

(8) In the method of manufacturing a preform solder according to (6) or(7), a particle size of the second metal powder is 0.1 to 1000 μm.

(9) In the method of manufacturing a preform solder according to any oneof (6) to (8), a particle size of the first metal powder is 0.1 to 1000μm.

(10) In the method of manufacturing a preform solder according to anyone of (6) to (9), a content of Ni in the second metal powder is 80 mass% or more and 99 mass % or less with respect to a total mass of thesecond metal powder.

(11) In the method of manufacturing a preform solder according to (10),a content of Fe in the second metal powder is 1 mass % or more and 20mass % or less with respect to the total mass of the second metalpowder.

(12) In the method of manufacturing a preform solder according to anyone of (6) to (11), a melting point of the first metal powder is 250° C.or less.

(13) A method of manufacturing a solder joint formed in a bonding areabetween objects using the preform solder manufactured by the method ofmanufacturing a preform solder according to any one of (6) to (12).

(14) A preform solder including a first metal containing Sn and a secondmetal formed of an alloy containing Ni and Fe, wherein a melting pointof the first metal is 250° C. or less, a melting point of the alloy inthe second metal exceeds 250° C., a content of Sn in the first metal is20 mass % or more and 100 mass % or less with respect to a total mass ofthe first metal, a content of Ni in the second metal is 80 mass % ormore and 99 mass % or less with respect to a total mass of the secondmetal, a content of Fe in the second metal is 1 mass % or more and 20mass % or less with respect to the total mass of the second metal, aparticle size of the second metal is 0.1 to 1000 μm, and a content ofthe second metal is 5 to 70 mass % with respect to a total content ofthe first metal and the second metal.

(15) A preform solder having a metal structure including a first phasethat is a continuous phase and a second phase dispersed in the firstphase, wherein the first phase is formed of a metal containing Sn, thesecond phase is composed of an alloy containing Ni and Fe, a meltingpoint of the metal that composes the first phase is 250° C. or less, amelting point of the alloy that composes the second phase exceeds 250°C., a content of Sn in the metal that composes the first phase is 20mass % or more and 100 mass % or less with respect to a total mass ofthe metal, a content of Ni in the alloy that composes the second phaseis 80 mass % or more and 99 mass % or less with respect to a total massof the alloy, a content of Fe in the alloy that composes the secondphase is 1 mass % or more and 20 mass % or less with respect to thetotal mass of the alloy, a particle size of the alloy is 0.1 to 1000 μm,the content of the alloy that composes the second phase is 5 to 70 mass% with respect to a total content of the metal that composes the firstphase and the alloy that composes the second phase, and a grain boundaryof the metal is present in the first phase.

(16) The preform solder according to (15), a content of intermetalliccompound of Sn and Ni in the metal structure being 0 mass % or more and70 mass % or less with respect to a total mass of the metal structure.

(17) A method of manufacturing a preform solder including: a mixingprocess of mixing a first metal powder containing Sn and a second metalpowder formed of an alloy containing Ni and Fe and preparing a metalpowder mixture; and a rolling process of rolling the metal powdermixture and fabricating a preform solder, wherein a melting point of thefirst metal powder is 250° C. or less, a melting point of the alloy inthe second metal powder exceeds 250° C., a content of Sn in the firstmetal powder is 20 mass % or more and 100 mass % or less with respect toa total mass of the first metal powder, a content of Ni in the secondmetal powder is 80 mass % or more and 99 mass % or less with respect toa total mass of the second metal powder, a content of Fe in the secondmetal powder is 1 mass % or more and 20 mass % or less with respect tothe total mass of the second metal powder, a particle size of the firstmetal powder is 0.1 to 1000 μm, a particle size of the second metalpowder is 0.1 to 1000 μm, and in the mixing process, the first metalpowder and the second metal powder are mixed at a ratio of 30 to 95parts of the first metal powder and 5 to 70 parts of the second metalpowder.

(18) A method of manufacturing a solder joint formed in a bonding areabetween objects using the preform solder manufactured by the method ofmanufacturing a preform solder according to claim 17).

According to the present invention, it is possible to provide a preformsolder and method of manufacturing the same that are capable of furthersuppressing occurrence of voids during solder bonding.

In addition, according to the present invention, it is possible toprovide a method of manufacturing a solder joint capable of increasingshear strength.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an embodiment of a preform solder.

FIG. 2 is an SEM image (magnification 300 times) showing a cross sectionin a thickness direction of the embodiment of the preform solder.

DETAILED DESCRIPTION OF THE INVENTION (Preform Solder: First Embodiment)

FIG. 1 is an embodiment of a preform solder according to the presentinvention. A preform solder 1 has a square form and includes a firstmetal containing Sn, and a second metal formed of an alloy containing Niand Fe.

<First Metal>

The first metal contains Sn.

Since Sn has excellent spreadability, the first metal containing Sn caneliminate the cavities between the first metals by plastic deformation.In addition, the first metal containing Sn can guarantee generalperformance with regard to such as wettability or the like for thesoldering material.

The first metal may contain a metal other than Sn. That is, the firstmetal may be Sn alone, a mixture of Sn and a metal other than Sn, analloy of Sn and a metal other than Sn, or may be a mixture in which thealloy containing Sn and other metals are mixed.

As the metal other than Sn, which may be contained in the first metal,for example, Ag, Cu, In, Bi, Ni, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt,Pd, Fe, Mn, and Zr may be exemplified. Regarding these metals other thanSn, one metal may be contained, or may two or more metals may becontained.

The first metal may contain inevitable impurities other than theabove-mentioned metals. Despite these inevitable impurities beingcontained, no influence in exerted on the effects of the presentinvention thereby.

A melting point of the first metal is preferably 250° C. or lower, morepreferably 232° C. or lower, and further preferably 116 to 200° C.

When the melting point of the first metal is less than or equal to theupper limit of the preferable range, it is easy to secure wettability ofthe solder.

“The melting point of the metal or the melting point of the metalpowder” disclosed herein refers a melting point measured by differentialscanning calorimetry (DSC). The melting point of the first metal can bemeasured using, for example, a DSC7020 manufactured by Hitachi High-TechScience Company. The melting point of the second metal can be measuredusing, for example, a DSC404-F3 Pegasus manufactured by NETZSCH company.

A content of Sn in the first metal is preferably 20 mass % or more and100 mass % or less with respect to a total mass of the first metal. Inorder for properties of Sn to be sufficiently exhibited, the content ofSn in the first metal is preferably 90 mass % or more, more preferably95 mass % or more, and further preferably 100 mass % with respect to thetotal mass of the first metal.

<Second Metal>

The second metal is formed of an alloy containing Ni and Fe.

The alloy in the second metal contains Ni and Fe, a melting point of thesecond metal is higher than that of the first metal, and the secondmetal is preferably dispersed in the preform solder.

The melting point of the alloy in the second metal preferably exceeds250° C., more preferably 300° C. or more, and further preferably 500 to1500° C.

When the melting point of the alloy in the second metal exceeds thelower limit of the preferable range, it becomes easier to achieve thehigh temperature of the solder joint.

The alloy in the second metal may contain a metal other than Ni and Fe.That is, the second metal may be an alloy of Ni and Fe, may be an alloyof Ni, Fe and a metal other than them, and among these, may be an alloyof Ni and Fe.

As the metal other than Ni and Fe, which may be contained in the secondmetal, for example, Ag, Cu, In, Bi, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al,Pt, Pd, Mn, and Zr are exemplified. These metals other than Ni and Femay contain one metal, or two or more metals.

The second metal may contain inevitable impurities other than theabove-mentioned metal. Even when the inevitable impurities arecontained, it does not exert an influence on the effect of the presentinvention.

Contents of Ni in the second metal is preferably 80 mass % or more and99 mass % or less, and more preferably 85 mass % or more and 95 mass %or less with respect to the total mass of the second metal.

Contents of Fe in the second metal is preferably 1 mass % or more and 20mass % or less, and more preferably 5 mass % or more and 15 mass % orless with respect to the total mass of the second metal.

When the contents of Ni and Fe in the second metal are within thepreferable range, an intermetallic compound is formed at an earlierstage, and occurrence of the voids can be minimized.

In the preform solder according to the first embodiment, the secondmetal has a particle size that is preferably 0.1 to 1000 μm, morepreferably 1 to 100 μm, and further preferably 5 to 50 μm.

When the particle size of the second metal is equal to or greater thanthe lower limit of the preferable range, wettability is easily secured,and when equal to or less than the upper limit of the preferable range,the intermetallic compound is more easily formed.

“The particle size of the metal or the particle size of the metalpowder” disclosed herein refers an average particle size when measuredwith reference to a volume using a laser diffraction/scattering-typeparticle size distribution measuring device.

In the preform solder according to the first embodiment, from theviewpoint of compatibility between bondability and shear strength, amixing ratio of the first metal and the second metal is represented asthe content of the second metal with respect to the total contents ofthe first metal and the second metal, which is preferably 5 to 70 mass%, more preferably 10 to 50 mass %, and further preferably 20 to 30 mass%.

When the content of the second metal is equal to or greater than thelower limit of the preferable range, occurrence of the voids during Snmelting is easily minimized. In addition, heat resistance of the solderbonding portion is further improved. When equal to or less than theupper limit of the preferable range, occurrence of the voids isminimized by suppressing generation of a porous structure due toformation of the intermetallic compound, and shear strength is easilysecured. In particular, occurrence of micro voids in the solder bondingportion is easily minimized.

In the preform solder according to the first embodiment, it ispreferable that the intermetallic compound of the first metal and thesecond metal is not contained, or a very small content is contained.With such a preform solder, occurrence of the voids is more likely to beminimized during solder bonding.

(Preform Solder: Second Embodiment)

FIG. 2 is a SEM image (magnification 300 times) showing a cross sectionin a thickness direction in the embodiment of the preform solderaccording to the present invention. Further, the SEM image of FIG. 2 isan observation image of a cross section parallel to a rolling directionin the preform solder manufactured by a rolling method.

The preform solder 1 shown in FIG. 2 has a metal structure including afirst phase 10 that is a continuous phase, and a second phase 20dispersed in the first phase 10.

The first phase 10 contains Sn. A grain boundary 15 of the metal ispresent in the first phase 10. The second phase 20 is formed of an alloycontaining Ni and Fe.

In the preform solder 1, the first phase 10 is a continuous phase, andcomposed by a metal containing Sn. Description of the metal containingSn and content thereof is the same as the above-mentioned <first metal>.

In addition, the grain boundary 15 is present between metal crystalscontaining Sn in the first phase 10.

In the preform solder 1, the second phase 20 is dispersed in the firstphase 10.

The second phase 20 is formed of an alloy containing Ni and Fe.Description of the alloy containing Ni and Fe, the particle sizesthereof, the contents thereof, and the like, are the same as theabove-mentioned <second metal>.

In the preform solder 1, from the viewpoint of the bondability and theshear strength, a mixing ratio of the metal containing Sn that composesthe first phase 10 and an alloy containing Ni and Fe that compose thesecond phase 20 is represented as the content of the alloy that composesthe second phase 20 with respect to the total content of the metal thatcomposes the first phase 10 and the alloy that composes the second phase20, which is preferably 5 to 70 mass %, more preferably 10 to 50 mass %,and further preferably 20 to 30 mass %.

When the content of the alloy that composes the second phase 20 is equalto or greater than the lower limit of the preferable range, occurrenceof the voids during Sn melting is easily minimized. In addition, heatresistance of the solder bonding portion is further improved. When equalto or less than the upper limit of the preferable range, occurrence ofthe voids is minimizing by suppressing generation of the porousstructure due to formation of the intermetallic compound, and shearstrength is easily secured.

While the metal structure that composes the preform solder 1 includesthe first phase 10 and the second phase 20, a third phase containing anintermetallic compound is present between the first phase 10 and thesecond phase 20 or its abundance is low.

In the preform solder 1, the content of the intermetallic compound of Snand Ni in the metal structure is small, preferably 0 mass % or more and70 mass % or less, more preferably 0 mass % or more and 30 mass % orless, and most preferably 0 mass % with respect to the total mass of themetal structure.

In the preform solder 1, when the content of the intermetallic compoundof Sn and Ni in the metal structure is equal to or less than the upperlimit of the preferable range, occurrence of the voids is more likely tobe minimized during solder bonding.

As the shape of the preform solder according to the above-mentionedfirst embodiment or second embodiment, a square shape, a ribbon shape, adisk shape, a washer shape, a chip shape, a wire shape, and the like,are exemplified.

In manufacturing of the preform solder according to the above-mentionedfirst embodiment or second embodiment, a known manufacturing method canbe used, and for example, a melting method and a rolling method can beapplied thereto. Among these, in manufacturing of the preform solderaccording to the embodiment, in particular, generation of theintermetallic compound of Sn and Ni is easily suppressed, occurrence ofa large diameter of voids can be minimized, the amount of the voidsoccurred is small and difficult to occur, and thus, it is preferable toapply the rolling method.

As described above, the preform solder according to the embodiment iscomposed of the first metal containing Sn, and the second metal formedof an alloy containing Ni and Fe.

In the preform solder according to the embodiment, since it is differentfrom the TLP paste or the like used in the related art and the flux isnot used, voids are unlikely to occur under the high temperatureconditions.

In addition, in the preform solder according to the embodiment, sincethe alloy containing Ni and Fe is used as the second metal, occurrenceof the voids is further minimized, and in particular, occurrence of thevoids can be further minimized during solder bonding under the hightemperature condition (250° C. or more). The reason which such an effectis obtained is not clear, but it is presumed as follows.

During reflow, the alloy containing Ni and Fe reacts with the firstmetal containing Sn to generate an intermetallic compound Ni₃Sn₄.

Meanwhile, when Cu is used instead of the alloy containing Ni and Fe,during reflow, Cu reacts with the first metal containing Sn to generatean intermetallic compound Cu₆Sn₅(Cu₃Sn).

Comparing the case in which the alloy containing Ni and Fe is used withthe case in which Cu is used, the amount of Sn consumed differs. Inaddition, generation of the intermetallic compound may be faster in thisembodiment. That is, in the embodiment, during reflow, since a largeamount of Sn is used and Sn is consumed quickly, the melting behavior ofSn is suppressed.

In addition, when the content of the second metal formed of the alloycontaining Ni and Fe increases, the content (area %) of theintermetallic compound Ni₃Sn₄ in the bonding area tends to increase. Fecontributes to this, and the action of Fe causes more intermetalliccompounds to be generated. When the alloy containing Ni and Fe is used,a compound containing Fe is formed in the intermetallic compound Ni₃Sn₄.The presence or absence of Fe in the intermetallic compound variesdepending on an analysis site, and it does not necessarily result in thecompound containing Fe, but it is considered that Fe along does notexist in the preform solder.

As described above, by suppressing the melting behavior of Sn andgenerating the intermetallic compound, occurrence of the voids isminimized in the preform solder according to the embodiment, and inparticular, occurrence of the voids can be minimized during solderbonding under the high temperature condition (250° C. or more).

(Method of Manufacturing Preform Solder)

An embodiment of a method of manufacturing a preform solder according tothe present invention is a manufacturing method including a mixingprocess of mixing first metal powder containing Sn and second metalpowder formed on an alloy containing Ni and Fe and preparing a metalpowder mixture, and a rolling process of rolling the metal powdermixture and fabricating a preform solder.

First Metal Powder:

The metal that composes the first metal powder used in the embodiment isa metal containing Sn. Description of the metal containing Sn is thesame as the above-mentioned <first metal>.

The melting point of the first metal powder is preferably 250° C. orless, more preferably 232° C. or less, and further preferably 116 to200° C.

When the melting point of the first metal powder is equal to or lessthan the upper limit of the preferable range, wettability of the solderis easily secured.

The content of Sn in the first metal powder is preferably 20 mass % ormore and 100 mass % or less with respect to the total mass of the firstmetal powder. In order to sufficiently exhibit properties of Sn, thecontent of Sn in the first metal powder is preferably 90 mass % or more,more preferably 95 mass % or more, and further preferably 100 mass %with respect to the total mass of the first metal powder.

The first metal powder has a particle size that is preferably 0.1 to1000 μm, more preferably 1 to 100 μm, and further preferably 5 to 50 μm.

When the particle size of the first metal powder is equal to or greaterthan the lower limit of the preferable range, wettability is easilysecured, and when equal to less than the upper limit of the preferablerange, the intermetallic compound is more easily formed.

Second Metal Powder:

The metal that composes the second metal powder used in the embodimentis the alloy containing Ni and Fe, and the melting point thereof ishigher than that of the first metal powder. Description of the alloycontaining Ni and Fe is the same as the above-mentioned <second metal>.

The melting point of the alloy in the second metal powder preferablyexceeds 250° C., is more preferably 300° C. or more, and furtherpreferably 500 to 1500° C.

When the melting point of the second metal powder exceeds the lowerlimit of the preferable range, it is easy to achieve the hightemperature of the solder joint.

The content of Ni in the second metal powder is preferably 80 mass % ormore and 99 mass % or less, and more preferably 85 mass % or more and 95mass % or less with respect to the total mass of the second metalpowder.

The content of Fe in the second metal powder is preferably 1 mass % ormore and 20 mass % or less, and more preferably 5 mass % or more and 15mass % or less with respect to the total mass of the second metalpowder.

When the contents of Ni and Fe in the second metal powder is within thepreferable range, the intermetallic compound is formed in an earlierstage, and occurrence of the voids can be minimized.

The second metal powder has a particle size that is preferably 0.1 to1000 μm, more preferably 1 to 100 μm, and further preferably 5 to 20 μm.

When the particle size of the second metal powder is equal to or greaterthan the lower limit of the preferable range, wettability is easilysecured, and when equal to or less than the upper limit of thepreferable range, the intermetallic compound is more easily formed.

[Mixing Process]

In the mixing process, the first metal powder and the second metalpowder are mixed to prepare a metal powder mixture.

A compounding ratio when both are mixed is preferably a ratio in whichthe first metal powder 30 to 95 parts and the second metal powder 5 to70 parts are mixed, more preferably a ration in which the first metalpowder 50 to 90 parts and the second metal powder 10 to 50 parts aremixed, further preferably a ratio in which the first metal powder 70 to80 parts and the second metal powder 20 to 30 parts are mixed.

Since the compounding ratio when both are mixed is within the preferablerange, occurrence of the voids is minimized, shear strength is easilysecured, and heat resistance of the solder bonding portion is furtherimproved.

[Rolling Process]

In the rolling process, the metal powder mixture fabricated through themixing process is rolled, and the preform solder formed in a desiredshape is fabricated.

In the method of rolling the metal powder mixture, a known rollingmethod may be used, and for example, it may be processed using a doubleroll type roller or the like. The number of rolling times, and a rollingload applied to the metal powder mixture may be appropriately setaccording to a desired shape and thickness of the target preform solder.

As described above, the method of manufacturing a preform solderaccording to the embodiment includes the mixing process of mixing thefirst metal powder and the second metal powder and preparing the metalpowder mixture, and the rolling process. In the mixing process, sincethe alloy containing Ni and Fe is employed as the second metal powderand the metal powder mixture is processed through rolling, the preformsolder in which generation of the intermetallic compound of Sn and Ni inthe metal structure is suppressed and occurrence of the voids duringsolder bonding is further minimized can be easily manufactured.

The method of manufacturing a preform solder according to the embodimentis useful as the method of manufacturing the preform solder according tothe first embodiment or the second embodiment.

The method of manufacturing a preform solder according to the presentinvention is not limited to the above-mentioned embodiment, and forexample, may be an embodiment further including another process inaddition to the above-mentioned mixing process and rolling process.

In addition, the method of manufacturing a preform solder according tothe present invention is not limited to the embodiment, and may usemetal powder (hereinafter, also referred to as “third metal powder”)other than the first metal powder and the second metal powder.

The third metal powder is not particularly limited to the composition aslong as the composition of the first metal powder and the second metalpowder differs, and preferably powder formed of a single metal such asCu, Ag, Al or Ni, or an alloy formed of two or more elements of thesesingle metals.

The third metal powder has a particle size that is preferably 0.1 to1000 μm, more preferably 1 to 100 μm, and further preferably 5 to 50 μm.

The metal that composes the third metal powder may contain one kind ortwo or more kinds.

(Method of Manufacturing Solder Joint)

An embodiment of the method of manufacturing a solder joint according tothe present invention is a manufacturing method of forming a bondingarea between objects using the preform solder manufactured by theabove-mentioned (method of manufacturing a preform solder).

The objects to be bonded by applying such a manufacturing method are notparticularly limited. For example, the semiconductor element and theboard can be bonded by applying such a manufacturing method.

As the semiconductor element, a silicon carbide (SiC) chip, a Si chip,or the like, is exemplified.

As the board, a circuit board, a ceramic board, a metal board, a directcopper bonding (DCB) board, or the like, is exemplified. An electrode onthe board may be, for example, a Cu electrode, or a Cu electrodeprocessed with any one of Sn plating, Ni plating, Ni—Au plating, Ni—Pdplating and Ni—Pd—Au plating.

Further, during bonding, the flux may be applied in advance to one orboth surfaces of the preform solder, which become bonding surfaces, abonding surface of the semiconductor element, or a bonding surface ofthe board.

A temperature when the semiconductor element and the board are bondedis, for example, preferably 120° C. or more and 400° C. or less, may be200° C. or more and 400° C. or less, or may be 250° C. or more and 400°C. or less, and the method of manufacturing a solder joint of theembodiment is useful in bonding under the high temperature condition(250° C. or more).

The atmosphere when the objects are bonded may be nitrogen atmosphere ormay be reducing atmosphere.

In the case of the nitrogen atmosphere, the pressure applied duringbonding is adjusted to preferably 0.1 MPa or more and 10 MPa or less.Under such a nitrogen atmosphere, the effect of minimizing occurrence ofthe voids is enhanced by bonding the objects.

In the case of the reducing atmosphere, the objects can be bondedwithout pressurization.

As described above, in the method of manufacturing a solder jointaccording to the embodiment, during reflow, since the alloy containingNi and Fe reacts with the first metal containing Sn to generate theintermetallic compound, heat resistance of the solder bonding portion isfurther improved. In addition, since occurrence of the voids in thesolder bonding portion is further minimized, it is possible tomanufacture the solder joint with the increased shear strength.

The method of manufacturing a solder joint according to the embodimentis particularly useful in applications where the high temperature solderthat is not melted is required, during operation under the hightemperature condition like the power semiconductor element.

Hereinabove, while the embodiment of the disclosure has been describedin detail with reference to the accompanying drawings, characteristicparts may be enlarged for convenience in these drawings, and dimensionalratios or the like of the components are not limited to those shown inthe drawings.

A specific configuration of the embodiment according to the presentinvention is not limited to the embodiment of the disclosure, and may bechanged or substituted without departing from the spirit of thedisclosure.

EXAMPLE

Hereinafter, while the present invention has been described according tothe example, the present invention is not limited to the followingexample. In the example, metal powder as described below is used.

In the particle size of the metal powder, an average particle size wasmeasured with reference to a volume using a laserdiffraction/scattering-type particle size distribution measuring device.

The melting point of the metal powder was measured by differentialscanning calorimetry (DSC) using DSC7020 manufactured by HitachiHigh-Tech Science Company in the case of the first metal powder andusing DSC404-F3 Pegasus manufactured by NETZSCH Company in the case ofthe second metal powder.

First Metal Powder:

Metal powder (Sn 100 mass % powder) particle size 10 μm and meltingpoint 232° C. of Sn 100 mass %

Metal powder (Sn 100 mass % powder) particle size 20 μm and meltingpoint 232° C. of Sn 100 mass %

Metal powder (Sn 100 mass % powder) particle size 30 μm and meltingpoint 232° C. of Sn 100 mass %

Metal powder (Sn 100 mass % powder) particle size 35 μm and meltingpoint 232° C. of Sn 100 mass %

Metal powder (Sn42Bi58 mass % powder), particle size 10 μm, and meltingpoint 139° C., formed of alloy of Sn 42 mass % and Bi 58 mass %

Metal powder (Sn48In52 mass % powder), particle size 10 μm, and meltingpoint 116° C., formed of alloy of Sn 48 mass % and In 52 mass %

Second Metal Powder:

Metal powder (Ni-10 mass % Fe powder), and particle size 10 μm, formedof alloy of Ni 90 mass % and Fe 10 mass %

Metal powder (Ni-1 mass % Fe powder), and particle size 10 μm, formed ofalloy of Ni 99 mass % and Fe 1 mass %

Metal powder (Ni-20 mass % Fe powder), and particle size 10 μm, formedof alloy of Ni 80 mass % and Fe 20 mass %

Third Metal Powder:

Metal powder (Cu 100 mass % powder) particle size 10 μm of Cu 100 mass %

Metal powder (Ni 100 mass % powder) particle size 10 μm of Ni 100 mass %

Metal powder (Fe 100 mass % powder) particle size 10 μm of Fe 100 mass %

<Manufacturing of Soldering Material>

Each of the above-mentioned first metal powder, second metal powder andthird metal powder was fabricated. A soldering material of each examplewas measured using metal powder thereof.

Example 1 Mixing Process:

88 parts of Sn 100 mass % powder with a particle size 10 μm as the firstmetal powder and 12 parts of Ni-10 mass % Fe powder with a particle size10 μm as the second metal powder were agitated to manufacture the metalpowder mixture.

Rolling Process:

Next, the prepared metal powder mixture was introduced into a hopper ofthe double roll type roller, the number of rolling was set to one, therolling load was about 20 kN, and thus, a strip-shaped rolling materialwas obtained. The rolling material obtained in this way was punched by apress machine to fabricate a preform solder having a thickness of 0.15mm and a square shape of 5 mm×5 mm.

In the fabricated preform solder of Example 1, cross section observationin a thickness direction (magnification 300 times) was performed usingan electron microscope (manufactured by JEOL Corp., JSM-7000F) under acondition of an applied voltage 15 kV.

As a result, it has been confirmed that the preform solder of Example 1has the metal structure including the same shape as the SEM image shownin FIG. 2, i.e., the first phase that is a continuous phase and thesecond phase dispersed in the first phase, and a grain boundary of themetal is present in the first phase.

Examples 2 to 17

As shown in Tables 1 and 2, like Example 1 except that the first metalpowder and the second metal powder are used at a predetermined mixingratio, the mixing process and the rolling process were performed insequence, and the preform solder having a thickness of 0.15 mm and asquare shape of 5 mm×5 mm was fabricated.

Comparative Example 1

88 parts of Sn 100 mass % powder with a particle size 10 μm as the firstmetal powder and 12 parts of Ni-10 mass % Fe powder with a particle size10 μm as the second metal powder were agitated to prepare the metalpowder mixture.

Next, 88.5 parts of the metal powder mixture and 11.5 parts of the fluxshown in the following were mixed to prepare the solder paste.

Flux (composition): rosin 46 mass %, solvent 32 mass %, thixo agent 8mass %, activator 14 mass %

Comparative Examples 2 to 4

As shown in Table 2, like Example 1 except that the first metal powderand the third metal powder are used at a predetermined mixing ratio, themixing process and the rolling process were performed in sequence tofabricate the preform solder having a thickness of 0.15 mm and a squareshape of 5 mm×5 mm.

<Manufacturing of Solder Joint>

The fabricated preform solder of each example was mounted on a Cu boardhaving a thickness of 0.5 mm and a size of 50 mm×50 mm, an Si boardhaving a thickness of 0.4 mm and a size of 5 mm×5 mm was mounted on thepreform solder, and soldering was performed.

After that, in a profile in which a peak temperature is 250° C. and acooling speed is 2° C./sec, the soldering was performed in a reflowfurnace with no pressurization or with pressurization under the formicacid atmosphere, and the solder joint was fabricated.

When each of preform solders of Examples 1, 4, 5, 11 to 13, 16 and 17and Comparative examples 1 to 4 was used, the soldering was performedwith no pressurization, and the solder joint was fabricated.

When the preform solder of each of Examples 2, 3, 6 to 10, 14 and 15 wasused, the soldering was performed with pressurization, and the solderjoint was fabricated.

<Estimation>

In the fabricated solder joint, content, a void fraction and shearstrength of each of the intermetallic compound and the first metal inthe bonding area were measured as described below. Results ofmeasurement and estimation thereof are shown in Tables 1 and 2.

[Measurement of Content of Each of Intermetallic Compound and FirstMetal in Bonding Area, and Void Fraction]

In the fabricated solder joint, a cross section SEM photograph wasimaged by an electron microscope (manufactured by JEOL Corp.,JSM-7000F). In the cross section SEM photograph, the void fraction (area%) was calculated for the places bonded by the preform solder as a wholeexcept upper and lower members.

In addition, a content of the intermetallic compound, a content of Sn, acontent of Bi, and a content of In (each area %) in the bonding areawere calculated from contrast using image analysis software “Scandium”of West Bloom Digital Image Corp.

Further, a sum of area % of the content of the intermetallic compound,the content of Sn, the content of Bi, the content of In, and the voidfraction was 100 area %.

[Measurement of Shear Strength]

In the fabricated solder joint, shear strength (N) in the bonding areawas measured under a condition of 6.0 mm/min and 250° C. by a shearingstrength measuring device (manufactured by Rhesca Company, STR-1000).

It was measured as “A” when the measured shear strength is 1.0 N or moreand it was measured as “B” when less than 1.0 N.

TABLE 1 Ex) 1 Ex) 2 Ex) 3 Ex) 4 Ex) 5 Ex) 6 Ex) 7 Ex) 8 Ex) 9 Ex) 10Metal First metal Sn 100 Powder 88 92 90 85 80 70 60 50 40 30 powderpowder mass % diameter powder 10 μm Sn 100 Powder mass % diameter powder20 μm Sn 100 Powder mass % diameter powder 30 μm Sn 100 Powder mass %diameter powder 35 μm Sn42Bi58 Powder mass % diameter powder 10 μmSn48In52 Powder mass % diameter powder 10 μm Second Ni-10 Powder 12 8 1015 20 30 40 50 60 70 metal mass % diameter powder Fe 10 μm powder Ni-1Powder mass % diameter Fe 10 μm powder Ni-20 Powder mass % diameter Fe10 μm powder Third Cu 100 Powder metal mass % diameter powder powder 10μm Ni 100 Powder mass % diameter powder 10 μm Fe 100 Powder mass %diameter powder 10 μm Form of soldering material Preform Preform PreformPreform Preform Preform Preform Preform Preform Preform Joining Contentof Area % 39.50 24.12 31.85 48.31 65.16 95.43 92.45 88.75 80.32 78.32area intermetallic compound Content of Sn Area % 56.49 66.34 61.11 48.5632.11 0 0 0 0 0 Content of Bi Area % — — — — — — — — — — Content of InArea % — — — — — — — — — — Estimation Void fraction Area % 4.01 9.547.04 3.14 2.73 4.57 7.55 11.25 19.68 21.68 Shear strength N 3.4 1.1 1.59.1 20.8 28.7 24.3 17.7 3.8 2.6 at 250° C. A or B A A A A A A A A A A

TABLE 2 Comp Comp Comp Comp Ex) 11 Ex) 12 Ex) 13 Ex) 14 Ex) 15 Ex) 16Ex) 17 Ex) 1 Ex) 2 Ex) 3 Ex) 4 Metal First Sn 100 Powder 88 88 88 8888   88   powder metal mass % diameter powder powder 10 μm Sn 100 Powder88 mass % diameter powder 20 μm Sn 100 Powder 88 mass % diameter powder30 μm Sn 100 Powder 88 mass % diameter powder 35 μm Sn42Bi58 Powder 88mass % diameter powder 10 μm Sn48In52 Powder 70 mass % diameter powder10 μm Second Ni-10 Powder 12 12 12 12 30 12 metal mass % diameter powderFe 10 μm powder Ni-1 Powder 12 mass % diameter Fe 10 μm powder Ni-20Powder 12 mass % diameter Fe 10 μm powder Third Cu 100 Powder 12 metalmass % diameter powder powder 10 μm Ni 100 Powder 12   10.8  mass %diameter powder 10 μm Fe 100 Powder 1.2 mass % diameter powder 10 μmForm of soldering material Preform Preform Preform Preform PreformPreform Preform Paste Preform Preform Preform Joining Content of Area %39.99 40.08 40.13 39.95 91.83 35.16 37.85 16.64 17.34 27.32 27.21 areaintermetallic compound Content of Sn Area % 56.38 56.37 56.39 9.17 055.33 54.72 27.32 41.97 44.44 46.84 Content of Bi Area % — — — 44.68 — —— — — — — Content of In Area % — — — — 0 — — — — — — Estimation Voidfraction Area % 3.63 3.55 3.48 6.20 8.17 9.51 7.43 56.04 40.69 28.2425.95 Shear strength at N 3.8 4.2 4.4 6.3 8.7 1.1 2.1 0 0 0.6 0.5 250°C. A or B A A A A A A A B B B B

From the results shown in Tables 1 and 2, it can be confirmed that thepreform solders of Examples 1 to 17, to which the present invention isapplied, have low void fractions in comparison with the paste ofComparative example 1 and the preform solders of Comparative examples 2to 4, and occurrence of the voids can be further minimized during solderbonding under a high temperature condition of 250° C.

In addition, it can be confirmed that the solder joints formed using thepreform solders of Examples 1 to 17 have increased shear strength.

EXPLANATION OF REFERENCES

-   -   1 Preform solder    -   10 First phase    -   15 Grain boundary    -   20 Second phase

What is claimed is:
 1. A preform solder comprising a first metalcontaining Sn, and a second metal formed of an alloy containing Ni andFe, wherein a melting point of the first metal is 250° C. or less, amelting point of the alloy in the second metal exceeds 250° C., acontent of Sn in the first metal is 20 mass % or more and 100 mass % orless with respect to a total mass of the first metal, a content of Ni inthe second metal is 80 mass % or more and 99 mass % or less with respectto a total mass of the second metal, a content of Fe in the second metalis 1 mass % or more and 20 mass % or less with respect to the total massof the second metal, a particle size of the second metal is 0.1 to 1000μm, and a content of the second metal is 5 to 70 mass % with respect toa total content of the first metal and the second metal.
 2. A preformsolder having a metal structure comprising a first phase that is acontinuous phase, and a second phase dispersed in the first phase,wherein the first phase is formed of a metal containing Sn, the secondphase is composed of an alloy containing Ni and Fe, a melting point ofthe metal that composes the first phase is 250° C. or less, a meltingpoint of the alloy that composes the second phase exceeds 250° C., acontent of Sn in the metal that composes the first phase is 20 mass % ormore and 100 mass % or less with respect to a total mass of the metal, acontent of Ni in the alloy that composes the second phase is 80 mass %or more and 99 mass % or less with respect to a total mass of the alloy,a content of Fe in the alloy that composes the second phase is 1 mass %or more and 20 mass % or less with respect to the total mass of thealloy, a particle size of the alloy is 0.1 to 1000 μm, the content ofthe alloy that composes the second phase is 5 to 70 mass % with respectto a total content of the metal that composes the first phase and thealloy that composes the second phase, and a grain boundary of the metalis present in the first phase.
 3. The preform solder according to claim2, wherein a content of an intermetallic compound of Sn and Ni in themetal structure is 0 mass % or more and 70 mass % or less with respectto a total mass of the metal structure.
 4. A method of manufacturing apreform solder comprising: a mixing process of mixing a first metalpowder containing Sn and a second metal powder formed of an alloycontaining Ni and Fe and preparing a metal powder mixture; and a rollingprocess of rolling the metal powder mixture and fabricating a preformsolder, wherein a melting point of the first metal powder is 250° C. orless, a melting point of the alloy in the second metal powder exceeds250° C., a content of Sn in the first metal powder is 20 mass % or moreand 100 mass % or less with respect to a total mass of the first metalpowder, a content of Ni in the second metal powder is 80 mass % or moreand 99 mass % or less with respect to a total mass of the second metalpowder, a content of Fe in the second metal powder is 1 mass % or moreand 20 mass % or less with respect to the total mass of the second metalpowder, a particle size of the first metal powder is 0.1 to 1000 μm, aparticle size of the second metal powder is 0.1 to 1000 μm, and in themixing process, the first metal powder and the second metal powder aremixed at a ratio of 30 to 95 parts of the first metal powder and 5 to 70parts of the second metal powder.
 5. A method of manufacturing a solderjoint formed in a bonding area between objects using the preform soldermanufactured by the method of manufacturing a preform solder accordingto claim 4.